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FLeXOY™ by Soytronics
Transcript of FLeXOY™ by Soytronics
FLeXOY™ is the
way to go!
How does this Impact the Soy Industry?
Soy Farmers can expect to become players in a $7-8 billion market as a raw substrate material provider
FLeXOY™ by Soytronics 100% biodegradable formula set as industry standard
Soy Farmers become prime supplier of soy materials
Current industry standards
are non-biodegradable and sometimes toxic
Electronic circuitry pollutants make major source of hazardous content found in municipal waste
However due to shorter
We have a
Team 25 Presents:
The Cost to Acquire a Customer (CAC) exceeds the Life Time Value (LTV) a customer brings us.
This is my third go-around selling to large enterprises, SkyStream, Kontiki and now Qumu.
I like to explain to you the problem the way I see it, the changes I suggest to avoid making the same mistake again. and
Travels to Clients
for Printed Circuit Boards and other applications in electornic device manufacturing
Novel Soy-based substrate
Pile up in landfills and cause harm to the environment
It has been estimated that the EU citizen produces 23 kg of electrical/electronic waste per annum
of this type of waste is deposited in landfill!
European Union (EU) implemented the WEEE (Waste Electrical and Electronic Equipment) and RoHS (Restriction of Substances) directives.
WEEE - reduce the quantity of electrical/electronic equipment being disposed of in landfill, by “promoting reduction, reuse, and recycling of equipment/component parts.”
RoHS - eliminate the “number of hazardous substances from the manufacturing process of such equipment that may eventually end up in landfill.”
AESO (Acrylated epoxidized soybean oil) or trade name Ebecryl 860
Acetic anhydride as a cross-linking agent to impart the necessary mechanical properties
N,N-dimethylbenzylamine as a catalyst to speed up the reaction.
Only substate that can claim to be both flexible and total biodegradable.
Expects strong demand with wave of regulatory change about to hit supplier base
will not compromising on performance and will be:
eco-friendly alternative to current epoxy resin-based substrates.
Designers will be able to creatively and synergistically improve current products as well as develop new products.
All 100% biodegradable!
Novel, next generation substrate that is soy based, and flexible, and 100% biodegradable!
IDTechEx: Printed Electronics technology
The promise of flexible electronics
The Soytronics team carried out an extensive literature and Patent review to understand its position in the market, identify potential competitors, develop trade secrets and highlight opportunities to file for patents to act as barriers to entry for other players.
1. Wool, R., Kusefoglu, S., Palmese, G., Khot, S., and Zhao, R. (2000) U.S. Patent No. 6121398 Washington, DC: U.S.
2. Wool, R., Lu, J. and Khot, S., (2005) U.S. Patent No. 6900261 Washington, DC: U.S.
3. Wool, R. and Hong, C. (2004) U.S Patent No. 396319 (Provisional) Washington DC: U.S.
4. Wool, R., Schiltz, D., and Steiner, D. (1992) U.S. Patent No. 5162392 Washington DC: U.S.
5. Urkumyan, N. (2005) U.S. Patent No. 210448 (Provisional) Washington DC: U.S.
6. Levin, W. (1986) U.S. Patent No. 4601120 Washinton DC: U.S.
7. Kilner, G. (1993) U.S. Patent No. 5177660 Washington DC.: U.S.
8. Katayama,N., Hayashi,Y., Kang, J. (2003) U.S. Patent No. 6951604 Washinton DC: U.S.
9. Yumoto, T. (2003) U.S. Patent No. 6588099 Washinton DC: U.S.
10. Johnston, P. (2008) U.S.Patent Application US 2008/0251278 A1
 Zhan, M.; Wool, R. P. “Biobased Composite Resins Design for Electronic Materials.” Journal of Applied Polymer Science. 2010. 118, 3274-3283. Print.
 Lu, J.; Hong, C. K.; Wool, R. P. “Bio‐based nanocomposites from functionalized plant oils and layered silicate.” Journal of Polymer Science B: Polymer Physics. 2004. 42,1441. Print,
 Can, E.; Kusefoglu,S.; Wool, R. P. Journal of Applied Polymer Science. 2002. 83, 972. Print.
 Lewis, H.J., and A. Ryan. "Using Electrically Conductive Inks and Adhesives as a Means to Satisfy European PCB Manufacturing Directives." Journal of Adhesion Science and Technology . 22.8-9 2008: 893-913. Print.
 Electronics Manufacturing, in: Pollution Prevention and Abatement Handbook, pp. 302-306. World Bank Group. 1998. Print.
 A. Ryan.; “An alternative manufacturing system for printed circuit boards.” PhD Thesis, University of Limerick. 2006. Print.
Amla, Tarun. Telephone Interview with Executive Vice President & Chief Technology Officer of Isola. 08 March 2012.
Butland, Geoff. Message to Carmen Valverde-Paniagua. 07 March 2012. WebEx.
Holder, Timothy. Telephone Interview with Supplier Quality Manager at GE. 07 March 2012.
Holder, Timothy. "Re:Biodegradable PCB Substrate - Thank You & Questions." Message to email@example.com, firstname.lastname@example.org, email@example.com, firstname.lastname@example.org. 07 March 2012. E-mail.
Schumacher, Hans. Telephone Interview with Corporate Director of Process Technology of Isola. 08 March 2012.
Trobough, Douglas. Telephone Interview with Corp Director Application Engineering of Isola. 08 March 2012.
Print & Web:
“Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment.” Official Journal of the European Union 46(L 3&), 19-23. 2003. Print.
"Flex Circuit Boards (FPCB)." San Francisco Circuits. N.p., n.d. Web. 2 Dec 2012. <http://www.sfcircuits.com/contact-us>.
Gomatam, R., and K.L. Mittal. Electrically Conductive Adhesives . 22. Brill, 2009. 221-25. Print.
"Material Safety Data Sheet." MSDS. 0.1. n. page. Print. <http://www.chembase.com>.
"PCB Substrate." China PCBA Manufacturer. STG , 16 May 2011. Web. 2 Dec 2012. <http://www.sfcircuits.com/contact-us>.
"Printed Circuit Board Substrates." Triangle Circuits. Triangle Circuits, 2008. Web. 21 Oct 2012. <http://www.trianglecircuits.com/substrates.html>.
The Environmental consequences of Pulp and Paper Manufacturing. Friends of the Earth Briefing sheet. 2 Feb 2012. <http://www.foe.co.uk/pubsinfo/breifings/html/19971215150024.htlml.
Team 25 - Soytrnoics - Soy Entry
Extensive networking with major PCB buyers and their respective PCB suppliers, Soytronics has pin pointed preferred laminate and substrate suppliers.
Of all providers it is evident that none provide 100% biodegradable solutions and the majority of their products are derived from epoxy resins and polyimide with ceramics/glass, PTFE, and phenolic options for specific applications.
In comparison, FLeXOY™ is 100% biodegradable, eco-friendly, and does not produce any toxic and harmful waste!
FLeXOY™ does not compromise on quality
Printed Circuit Board (PCBs) and flexible PCBs are found in all electronics including:
Overall markets that use PCBs include:
Industry that could benefit most from biodegradable PCB substrates are consumer electronics due to short life cycle.
The consumer electronics industry currently has revenue of $186,429 billion. The global flexible electronics market is set to grow to $250 billion by 2025. Thus, our product would feature as a division within the $250 billion market. Of this share $50 billion is solely on sales for PCBs and $7-8 billion made from substrates.
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Special Thanks To:
Prof. Michael Harris
Dr. Carol S. Stwalley
Manufacturers looking for eco-friendly alternatives
FLeXOY™ replaces traditional substrates
Soytrnoics' formula is 100% biodegradable and is positioned to become prime supplier for short life-cycle electronics
Demand for eco-friendly solutions opens billion dollar markets for Soy Farmers
FLeXOY™ can become leading brand and preferred substrate by manufacturers fueling more investment in green PCB substrates, and thus, the soy market
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