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Moore 2.0 從半導體發展趨勢與技術瓶頸看台灣未來的機會

如何克服成本效益(包括工程、產品量產與競爭力等),亟需系統性創新的方法來克服。例如,透過對市場需求與競爭力分析、製程節點與原件庫的選擇(library selection)、系統規格與架構設計、功率與時序驗證、測試(testing)與產品可靠度檢驗(reliability qualification)等方法等重新定義並做全盤性的分析與規劃 。 [http://funbroad.tw]

Hock Chen

on 12 May 2014

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Transcript of Moore 2.0 從半導體發展趨勢與技術瓶頸看台灣未來的機會

Moore 2.0
No Moore?
Improve the cost-effectiveness and competitiveness based on a mature process node!
「矽-資料探勘Silicon Data Mining」技術
Full transcript