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06/05/2019
Good heat resistance
Combinatorial cation mixtures
Ensure the intrinsic thermal stability (200°C) is a key issue before industrialization!
Non porous materials
Solid-state crystal synthesis
All inorganic Perovskites
2D/3D High PCE + superior stability
Larger organic cations
Lower defect densities
Low cost synthesis
Higher moisture resistance
Organic-Inorganic Perovskites
2D Perovskites
Defect Tolerant
High exciton binding e
Thermodynamic instability
Quantum confinement effects
Improves crystal quality
Vertical growth optimization
A2B(III)B(I)X6
Sn-based
(PCE 2-12%)
Pb-free Perovskites
Double perovskites Transitional metal ions
Au, Cu, Ti, Mn
Ge-based
(unstable)
Bi-based
(PCE 0.12-4.3%) low hysteresis
Sb-based
(PCE 0.5-3.08%)
wide bandgaps
unstable
Thermal evaporation
CVD
PLD
Sputtering
ALD
Vacuum process
Small organic molecules
Metal Oxides
Spray pyrolisis
FoM Transmittance-Sheet Resistance-Thickness
Spin coating
Solution process
Screen printing
Spray coating
No UV degradation
Hole-blocking properties (low HOMO / VB level)
Electron tunneling
Pinhole-free
Graphene derivatives
Small organic molecules
p-type Polymers
Hydrophobic semiconductor materials
Solution process
Get rid off Spiro-OMetad
Electron-blocking properties (High LUMO / CB level)
Find thermally stable materials
Buffer materials
Li+ migration
Al2O3
Halide ions
Ion migration
Temperature dependent crystal phase transition
Au+ ions (electrode)
Hysteresis
Li+ ions (spiro O-Metad)
Light soaking
Crystallinity
Absorption coefficient
Charge carrier lifetime
Dielectric constant
Recombination mechanisms
Band gap (direct or indirect?) Ideal 1.34eV-1.6eV
Mobility (above 10 cm2 V-1 s-1)
Effective mass
Defect density (grain boundaries)
Diffusion length
Coulomb forces
Exciton binding energy (ideally small)
Solvent engineering
Drop casting
In situ dipping
Spin coating
Vapor assisted solution processing
PLD
Melt processing (crystals)
2-Step depostiion
1-Step depostiion
Sequential vapor deposition
Capillary film growth
Electrochemical bath deposition
Annealing
Interfacial Chemical Reactions
Post-deposition treatment
Mechanical compression
2D/3D perovskites
Sealing and UV curing